Average Power Handling Capability of Microstrip Passive Circuits ...
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 11, NO. 2, FEBRUARY 2001. An Accurate 2-D Hard-Source Model for FDTD. Riku Mäkinen, Jaakko Juntunen ...
Packages for Terahertz Electronics - SciSpaceIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 12, NO. 11, NOVEMBER 2002. Low-Order Models From FD-TD Time Samples. Piotr Kozakowski, Student Member ... Fast Design Closure of Compact Microwave Components by Means ...Gadringer,. ?Analysis of variations of Volterra series models for RF power ampli- fiers,? IEEE Microw. Wireless Compon. Lett., vol. 23, no. 8, pp. 442?444,. Aug ... PERSONAL INFORMATIONIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 13, NO. 11, NOVEMBER 2003. Fig. 1. Package structure used for illustration of the TD-VF algorithm.
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